Binghamton's Integrated Electronics Engineering Center will bring to the alliance its world-class expertise in mechanics, thermal management and reliability, said Bahgat Sammakia, interim vice president for research and director of the IEEC, a New York state Center for Advanced Technology.

"The areas of research at Binghamton, at RPI's Center for Automation Technologies complement one another very well," Sammakia said. "We are excited to join this initiative with the Infotonics Center, and we expect great things to come from it."

Some of those things will be in the form of improved products and technologies in fields ranging from health care and homeland security to agriculture, consumer products and manufacturing processes, Sammakia said. Others will likely include significant increases in research funding as well as new opportunities to explore and refine collaborative working relationships across the region.

New machines that will be thinner than the human hair, diagnostics that will function at the molecular level, electronics packaging materials that will be lighter, stronger, and more versatile than anything now known-these are just a few of the expected fruits of such small-scale systems research and engineering, Sammakia said.

"Our part will be the fundamental science that supports the development of world-class products that can survive in the harshest of environments and conditions," he said. Electronics packaging is all-important to microsystems. Take the microprocessor out of your computer, lay it on your desk and you have little more than an interesting doodad. That's because in the same way that the potentials of the human brain are realized only as a result of the protection and env
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Contact: Susan E. Barker, Director of Research Advancement
sbarker@binghamton.edu
607-777-2640
Binghamton University
20-Nov-2003